AI Server

Digital Infrastructure

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For the thermal challenges of AI servers, high-speed optical modules, 5G communication base stations, and other equipment, SQ provides layered and fully integrated thermal management solutions across the entire system. Covering scenarios such as edge air cooling, cold-plate liquid cooling for complete systems, and ultra-thin uniform heat spreading for microdevices, we provide matched thermal interface materials, system-level protection, and customized thermal simulation services to address high-temperature, hotspot, and reliability challenges under high-density, high-power-consumption, and complex operating conditions, helping enable reliable thermal management for computing and communication equipment.

Liquid Cooling Module

A metal cold plate is attached to the surface of heat-generating components such as CPUs and GPUs. The coolant circulates through enclosed channels inside the cold plate to indirectly remove heat from the components. Since the coolant does not come into direct contact with electronic components, this is an indirect liquid cooling solution.
Manifold

The liquid cooling manifold is a core fluid distribution device in the secondary-side cooling loop of a liquid-cooled data center. It is designed to enable precise distribution, centralized recovery, and dynamic regulation of the cooling liquid.e "precise distribution – centralized recovery – dynamic regulation" of the cooling liquid.
Liquid Cooling Module

A metal cold plate is attached to the surface of heat-generating components such as CPUs and GPUs. The coolant circulates through enclosed channels inside the cold plate to indirectly remove heat from the components. Since the coolant does not come into direct contact with electronic components, this is an indirect liquid cooling solution.
Stainless Steel Bellows

Stainless steel bellows feature an all-metal structure, primarily comprising ultra-thin-walled 316L stainless steel tubing, joints, and insulating sleeves.
Graphene Thermal Pads

Graphene thermal pads are fabricated from silicone rubber and vertically oriented graphene fillers, featuring high thermal conductivity, low thermal resistance, and a high compression ratio, making them ideal for interface heat dissipation in high-power devices under low stress conditions.
Thermal Gel

The Single-Component Thermal Gel is a pre-formed, non-curing, non-flowing thermal interface material designed for filling micro gaps of up to 2 mm.
Manifold

The liquid cooling manifold is a core fluid distribution device in the secondary-side cooling loop of a liquid-cooled data center. It is designed to enable precise distribution, centralized recovery, and dynamic regulation of the cooling liquid.e "precise distribution – centralized recovery – dynamic regulation" of the cooling liquid.
UQD

The UQD is a standardized component used in liquid cooling systems for the rapid connection and disconnection of coolant piping
Liquid Cooling Module

A metal cold plate is attached to the surface of heat-generating components such as CPUs and GPUs. The coolant circulates through enclosed channels inside the cold plate to indirectly remove heat from the components. Since the coolant does not come into direct contact with electronic components, this is an indirect liquid cooling solution.
Industrial Server Cooling Fan

Designed specifically for high-density GPU computing platforms, our industrial-grade server cooling fans provide long-term, reliable air-cooling solutions for high-power computing applications.
Thermal Silicone Pad

The STP Series Thermal Silicone Pads are high-performance thermal interface materials (TIMs) designed to fill air gaps between heat-generating components and heat sinks, eliminating air pockets and improving heat transfer efficiency.

SQ supports the provision of customized comprehensive solutions

AI Server Company Product Applications

Liquid Cooling Module

Manifold

UQD

Stainless Steel Bellows

Thermal Silicone Pad

Thermal Gel

Industrial Server Cooling Fan

Graphene Thermal Pads

Liquid Cooling Module

A metal cold plate is attached to the surface of heat-generating components such as CPUs and GPUs. The coolant circulates through enclosed channels inside the cold plate to indirectly remove heat from the components. Since the coolant does not come into direct contact with electronic components, this is an indirect liquid cooling solution.

Manifold

The liquid cooling manifold is a core fluid distribution device in the secondary-side cooling loop of a liquid-cooled data center. It is designed to enable precise distribution, centralized recovery, and dynamic regulation of the cooling liquid.e "precise distribution – centralized recovery – dynamic regulation" of the cooling liquid.

UQD

The UQD is a standardized component used in liquid cooling systems for the rapid connection and disconnection of coolant piping

Stainless Steel Bellows

Stainless steel bellows feature an all-metal structure, primarily comprising ultra-thin-walled 316L stainless steel tubing, joints, and insulating sleeves.

Thermal Silicone Pad

The STP Series Thermal Silicone Pads are high-performance thermal interface materials (TIMs) designed to fill air gaps between heat-generating components and heat sinks, eliminating air pockets and improving heat transfer efficiency.

Thermal Gel

The Single-Component Thermal Gel is a pre-formed, non-curing, non-flowing thermal interface material designed for filling micro gaps of up to 2 mm.

Industrial Server Cooling Fan

Designed specifically for high-density GPU computing platforms, our industrial-grade server cooling fans provide long-term, reliable air-cooling solutions for high-power computing applications.

Graphene Thermal Pads

Graphene thermal pads are fabricated from silicone rubber and vertically oriented graphene fillers, featuring high thermal conductivity, low thermal resistance, and a high compression ratio, making them ideal for interface heat dissipation in high-power devices under low stress conditions.