Heat Pipe


A heat pipe is a passive, highly efficient heat transfer device that utilizes phase change of an internal working fluid to transfer heat, achieving an equivalent thermal conductivity of 5,000–10,000 W/(m·K). Heat is transferred through a continuous cycle of evaporation, vapor transport, condensation, and capillary-driven liquid return. With heat transfer performance far exceeding that of solid metals such as copper and aluminum, heat pipes rapidly transfer localized heat over long distances. They are widely used in electronics, servers, energy storage systems, new energy equipment, and aerospace thermal management applications.





Product Features
01
Excellent Heat Transfer Performance

Extremely High Thermal Conductivity;Excellent Temperature Uniformity;Flexible Heat Transfer Distance.

Excellent Heat Transfer Performance
02
Simple and Reliable Operation

Passive Self-Circulation;Robust and Reliable Structure;Multiple Wick Structure Options

Simple and Reliable Operation
03
High structural plasticity

Customizable Configurations;Flexible System Integration

High structural plasticity
04
Wide range of applicable environments

Broad Temperature Adaptability;Wide Heat Load Capability;Passive Thermal Regulation


Wide range of applicable environments
Product Specifications

Series

Physical property

Mechanical behavior

 

Length(mm)

Width(mm)

Thickness(mm)

Density(g/cm³)

Viscosity(Pa·s)

Hardness(°A)

Extensibility(%)

Tensile strength

(MPa)

Tear strength(KN/m)

Tompressive deformation(%)

Elastic restitution(%)

E-cigarette

1-100

1-100

1-100

1.11-1.13

1080-1260

40-50

420-580

7.7-8.5

23-31

16-18

60-63

E-watch

1-100

1-100

1-100

1.11-1.13

1080-1260

50-60

420-620

7.7-10.1

23-33

16

60-64

Mobile phone

1-100

1-100

1-100

1.10

150-160

40

550

6.5

40

17

61-65

Understand the Plan
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop, full-chain thermal management solution, ranging from thermal interface materials to liquid cooling systems. This covers a comprehensive product line, including carbon-based thermal conductive materials, interface thermal conductive consumables, heat pipes/VC soaking plate cooling components, air cooling modules, cold plate liquid cooling modules, and complete liquid cooling supporting systems for machines.