Single-Component Thermal Gel

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Single-Component Thermal Gel

The Single-Component Thermal Gel is a pre-formed, non-curing, non-flowing thermal interface material designed for filling micro gaps of up to 2 mm. With thermal conductivity ranging from 3 to 12 W/m·K, it supports automated dispensing, effectively compensates for assembly tolerances, and applies extremely low mechanical stress to electronic components—enabling near zero interface stress.

Product Features

Excellent Dispensing Performance

High extrusion rate exceeding 80 g/min with excellent anti-slump performance, ensuring stable dispensing without sagging.

High Thermal Conductivity

Thermal conductivity of up to 12 W/m·K, while maintaining excellent dispensability for automated production.

Low-Stress Performance

Low modulus and high compressibility enable effective filling of uneven component surfaces and gaps as small as 0.2 mm, minimizing mechanical stress on sensitive devices.

Long-Term Reliability

Excellent resistance to high- and low-temperature aging, with no cracking or powdering during long-term operation.

Product Specifications

model	Color (Customizable)	Density(g/cc)	Rate of extrusion （g/min /2.5mm @ 0.6Mpa）	End-use temperature(℃)	Thermal conductivity(W/m*k)	Thermal resistance(°Cin2/W) @10Psi@BLT	punch through voltage(kV)(@1mm)	mass resistivity（Ω·cm）	Flame retardant rating
STG35S-L160	Blue-green	3.0±0.2	160	-50~150	3.5	0.048	≥6	＞1012	V-0
STG40S-L80	Green	3.0±0.2	80	-50~150	4	0.038	≥6	＞1012	V-0
STG45S-L180	Pink	3.1±0.2	180	-50~150	4.5	0.044	≥6	＞1012	V-0
STG60S-L20	Gray	3.2±0.2	20	-50~150	6	0.035	≥6	＞1012	V-0
STG60S-L40	Gray	3.2±0.2	40	-50~150	6	0.038	≥6	＞1012	V-0
STG60S-L60	Gray	3.2±0.2	60	-50~150	6	0.038	≥6	＞1012	V-0
STG65S-L70	Blue	3.2±0.2	70	-50~150	6.5	0.036	≥6	＞1012	V-0
STG80S-L40	Gray	3.2±0.2	40	-50~150	8	0.059	≥6	＞1012	V-0
STG80S-L20	Gray	3.2±0.2	20	-50~150	8	0.035	≥6	＞1012	V-0
STG100S-L10	Gray	3.4±0.2	10	-50~150	10	0.051	≥6	＞1012	V-0
STG120S-L20	Gray	3.4±0.2	20	-50~150	12	0.051	≥6	＞1012	V-0

Understand the Plan

Full-chain solution from TIM material to liquid cooling system for AI data center

SiQuan New Materials provides a one-stop, full-chain thermal management solution, ranging from thermal interface materials to liquid cooling systems. This covers a comprehensive product line, including carbon-based thermal conductive materials, interface thermal conductive consumables, heat pipes/VC soaking plate cooling components, air cooling modules, cold plate liquid cooling modules, and complete liquid cooling supporting systems for machines.

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