R&D Capability
R&D Capability
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R&D Team
Relying on multi-level scientific and technological innovation platforms, including the national doctoral workstation and provincial engineering technology research center, SQ boasts a cross-disciplinary R&D team of over 400 people, with sustained R&D investment exceeding 8% of revenue. SQ independently masters the core processes across the entire value chain, including graphite heat dissipation, vapor chamber (VC) technology, and liquid cooling for AI servers, and holds 168 granted patents in China and internationally. In collaboration with academician teams from multiple universities, SQ has established joint laboratories for industry-university-research cooperation, enabling integrated in-house research and innovation from basic materials to liquid cooling modules for high-performance computing.
  • 400

    +

    R&D Team Members
  • 8%
    Ratio of R&D investment to revenue
  • 168

    +

    Domestic and International Invention Patents
  • 15
    Years of experience
Thermal Simulation Design
VCAS simulates the complete temperature and pressure fields within the vapor chamber, enabling analysis of surface temperature differences and internal pressure distribution to evaluate heat-spreading performance and working fluid return capability, while optimizing the chamber structure.

Multiple reinforcement designs are evaluated using VCAS. Temperature contours of the evaporator surface and pressure contours of the vapor chamber are analyzed to assess the effects of reinforcement on heat-spreading performance and vapor flow resistance, enabling selection of the optimal reinforcement design.

Using thermal simulation, heat transfer paths within the heat pipe–fin assembly are analyzed and optimized to achieve highly efficient heat-spreading performance.



A 3D vapor chamber (VC) thermal simulation model is developed to address the challenges of high heat flux, localized hot spots, and complex heat transfer paths in high-power chips. The model is used to evaluate and optimize thermal management solutions through simulation-driven performance analysis.



To address the thermal challenges of high-power chips, including high heat flux, localized hot spots, and complex heat transfer paths, a 3D vapor chamber (VC) thermal simulation model is developed. The model is used to evaluate thermal performance and optimize cooling designs.



To meet the thermal management requirements of robotic vacuum cleaners operating in compact spaces and under continuous workloads, vapor chamber (VC) heat-spreading technology and fin structures are incorporated. Thermal simulation is used to evaluate heat-spreading efficiency and temperature rise in critical areas, supporting thermal management optimization and performance enhancement.




A VC–graphite composite thermal management structure is evaluated through thermal simulation to analyze heat spreading and temperature rise characteristics, enabling efficient heat spreading and optimized thermal management for thin and lightweight devices.



R&D Laboratory

The four R&D laboratories form a full-chain R&D system covering basic new materials, carbon-based thermal conductive films, polymer thermal interface materials, and terminal heat dissipation modules. The laboratories cover frontier research, material formulation iteration, mass-production process development, and product reliability verification.

  • Graphite Materials Laboratory


    Dedicated to the research and process development of high-performance carbon-based graphite and graphene films, with expertise in conventional PI-based graphite sheets, bendable graphite films, next-generation precursor-derived graphite films, multilayer graphite modification, and graphene-based thermal management materials.


  • Polymer Materials Laboratory

    Focused on the formulation and engineering of silicone-based thermal interface materials (TIMs), high-performance electronic adhesives, and integrated thermal management and EMI functional materials.

    Core products include thermal gels, thermal greases, thermal pads, potting compounds, addition-cure silicone materials, carbon fiber thermal pads, electronic adhesives, thermally conductive structural adhesives, thermally conductive potting compounds, thermally conductive insulating materials, SLDT materials, and electromagnetic wave-absorbing materials.

  • Thermal Module Laboratory

    Dedicated to the development of air-cooling and liquid-cooling thermal management modules, as well as comprehensive product reliability validation systems.

    Core capabilities include welding technology, fluid system process development, prototype fabrication, manufacturing process optimization, and full-process development from prototype to mass production. The laboratory also addresses key industry challenges such as material degradation, leakage, high interfacial thermal resistance, and coolant-induced corrosion.


  • Advanced Materials Laboratory


    Serving as the innovation center for next-generation thermal management materials, the laboratory focuses on composite materials such as diamond-based thermal materials.

    Research covers material formulation, microstructure design, manufacturing processes, sintering, welding, and surface modification technologies. The laboratory is dedicated to overcoming challenges including poor interfacial bonding, complex manufacturing processes, and high production costs, providing high-performance, lightweight thermal management materials for next-generation applications.



Testing Laboratory


Equipped with a comprehensive range of precision testing instruments, our testing laboratory provides four core technical capabilities to support material development, product quality assurance, performance optimization, and reliability verification for thermal management solutions.



  • Thermal Performance Testing

    Utilizing advanced thermal analysis instruments including LFA, DSC, TGA, and TMA, we comprehensively characterize the thermal properties of graphite materials, including thermal conductivity, thermal expansion, and high-temperature stability.

    For thermal management modules, we evaluate thermal resistance, temperature uniformity, and maximum heat dissipation capacity to meet the requirements of devices with different power levels.

    For liquid cooling products, we have established a complete validation system covering incoming material inspection, welding quality assessment, performance evaluation, and reliability verification, ensuring consistent product quality throughout the entire development cycle.


  • Material Composition & Microstructural Analysis


    Material composition is analyzed using spectroscopic and chromatographic techniques. Microstructural characteristics and surface morphology are evaluated using SEM, 3D digital microscopes, and surface roughness testers, while FTIR spectroscopy is employed to identify material composition.



  • Mechanical & Physical Property Testing

    omprehensive mechanical and physical testing capabilities support the evaluation of both thermal management materials and liquid cooling products. For graphite materials, testing includes true density, interfacial peel strength, and flexural durability. For liquid cooling components, testing covers hydrostatic pressure resistance, burst pressure, bending resistance, vibration, and mechanical shock, ensuring reliable mechanical performance under demanding operating conditions.



  • Environmental Reliability Validation


    Comprehensive environmental reliability testing is conducted through salt spray, high- and low-temperature exposure, thermal shock, and other accelerated reliability tests to simulate extreme operating environments, including temperature cycling and high-temperature/high-humidity conditions. These evaluations verify long-term product stability, assess module reliability, and ensure consistent product quality throughout the service life.


Flow Resistance/Thermal Resistance Test