To address the thermal management requirements of high-power AI chips such as GB200, GB300, and Rubin, this project focuses on the development of laser welding processes aimed at replacing traditional vacuum brazing methods. The objectives are to resolve key challenges associated with brazing—such as the high rate of whole-furnace scrap, long production cycles, high energy consumption, and solder residue clogging of microchannels—while achieving low thermal deformation, high hermeticity, and automated mass production. This approach ensures no spatter generation and no solder residue entering the microchannels, thereby preventing flow channel blockage; furthermore, under prolonged thermal cycling (-40°C to 120°C), the weld seams exhibit no cracks or micro-leakages.