Stock Code
301489
Standard Vapor Chamber (VC)
The standard vapor chamber (VC) is an industrial-grade phase-change heat transfer device featuring an oxygen-free copper enclosure with a sintered copper powder or copper mesh wick structure.By utilizing the latent heat of phase change of an internal working fluid, it delivers ultra-high in-plane thermal conductivity far exceeding that of conventional copper and aluminum heat spreaders, making it an ideal thermal management solution for high-power applications.Standard VCs offer outstanding heat transfer capacity, extended heat spreading distance, high pressure resistance, a wide operating temperature range, and excellent long-term reliability. They are widely used in industrial equipment, new energy vehicles, energy storage systems, high-power servers, photovoltaic inverters, and advanced medical equipment.
Product Features
01
Ultra-High Thermal Conductivity
Delivers an in-plane equivalent thermal conductivity of 3000–20000 W/m·K, approximately 7–50 times higher than solid copper, enabling rapid and uniform heat spreading while significantly reducing heat source temperatures.
02
High Heat Transfer Capacity
Capable of transferring over 800 W of thermal power, making it ideal for high-power chips, power modules, and other high heat flux applications.
03
Wide Operating Temperature Range
Operates reliably in environments ranging from −40°C to 120°C, meeting the thermal requirements of industrial, automotive, and energy storage applications.
04
High Reliability
Manufactured using an integrated sintering process with a highly stable wick structure, providing excellent resistance to vibration and mechanical shock, with a service life exceeding 20 years.
05
Excellent Customization Capability
Available in customized sizes, shapes, and mounting configurations to meet specific application requirements, supporting flat, L-shaped, and various custom structural designs.
Product Specifications
|
Product size |
Thickness |
Heat source dimensions |
Capillary mesh |
Maximum thermal transfer power |
|
＜60*60mm |
1.2~2.5mm |
20*20mm |
Sintered copper mesh |
60W |
|
60~200mm |
2.5~5.0mm |
30*30mm |
Sintered copper mesh / Sintered copper powder |
500W |
|
200~350mm |
3.0~8.0mm |
50*50mm |
Composite capillary |
1200W |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SQ New Materials provides end-to-end thermal management solutions for AI data centers, covering the entire value chain from thermal interface materials (TIMs) to complete liquid cooling systems. Our product portfolio includes carbon-based thermal conductive materials, thermal interface materials, heat pipes, vapor chambers (VCs), heat sinks, air-cooling modules, cold plate liquid cooling modules, and complete liquid cooling systems.