Stock Code
301489
Ultra-thin Stainless Steel VC
Ultra-thin stainless steel VC retains the key advantages of conventional vapor chambers by rapidly spreading heat and improving overall thermal performance. Compared with traditional copper VCs, it offers a simpler manufacturing process, supports ultra-thin structural designs, and delivers lower production costs with excellent cost-performance.
In addition, its outstanding structural rigidity and environmental durability make it particularly suitable for the thermal management requirements of thin and lightweight precision electronic devices, while also providing excellent manufacturability for high-volume production.
Product Features
01
High Structural Rigidity
The SUS316L stainless steel substrate offers excellent mechanical strength and deformation resistance, preventing warping and denting in large-format structures while withstanding assembly stress.
02
Ultra-Thin Design
An integrated stamping process enables extremely thin VC structures, meeting the increasingly demanding space requirements of compact electronic devices.
03
High Manufacturing Efficiency
Eliminating complex etching processes shortens the production cycle by more than 30%, enabling faster delivery and efficient mass production.
04
Excellent Corrosion Resistance
SUS316L stainless steel provides superior oxidation and corrosion resistance, maintaining structural integrity and thermal performance under high-temperature and high-humidity environments.
05
Greater Design Flexibility
Supports fully stamped ultra-thin structures with excellent flatness, providing greater design freedom for next-generation lightweight electronic products.
Product Specifications
| Material | Service substance | Capillary structure | Moulding process | Edge banding | Working temperature(℃) | Thickness(mm) | Maximum size(mm) | Qmax(W) |
| Stainless steel | Distilled water | Steel mesh | Etching/Stamping | Laser welding | 30~120 | 0.23~0.25 | 50*80 | 3~4 |
| 0.27~0.30 | 80*100 | 4~6 | ||||||
| 0.30~0.33 | 80*100 | 5~8 | ||||||
| 0.35~0.45 | 100*100 | 6~10 | ||||||
| 0.55~0.65 | 100*100 | 10~20 |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SQ New Materials provides end-to-end thermal management solutions for AI data centers, covering the entire value chain from thermal interface materials (TIMs) to complete liquid cooling systems. Our product portfolio includes carbon-based thermal conductive materials, thermal interface materials, heat pipes, vapor chambers (VCs), heat sinks, air-cooling modules, cold plate liquid cooling modules, and complete liquid cooling systems.