Stock Code
301489Nanocrystalline soft magnetic materials are produced by subjecting amorphous alloys to controlled crystallization annealing, forming an ultrafine-grained soft magnetic alloy with an average grain size of approximately 10 nm. These advanced functional materials feature a simplified manufacturing process with one-step forming, reducing energy consumption while improving production efficiency. By optimizing the alloy composition, their magnetostriction can be reduced to nearly zero, resulting in outstanding soft magnetic properties. They combine the high saturation magnetic flux density (Bs) of iron-based amorphous alloys with the high magnetic permeability and low core loss of cobalt-based amorphous alloys, delivering exceptional overall magnetic performance.
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Items |
Range |
Test Method |
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1k107B Nanocrystalline thin strip |
Physical properties
|
colour |
Silver |
Visual |
|
Thickness (mm) |
0.018-0.025 |
—— |
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Curie temperature ℃ |
570 |
GB/T 3389.3 |
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Stack factor σ |
>0.8 |
—— |
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Operating temperature ℃ |
-50~120 |
—— |
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Magnetic performance
|
Magnetic induction B800/T |
≥1.2 |
ASTM A894 |
|
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Hc/(A/m) |
≤1.6 |
ASTM B887 |
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Core loss P0.5T/20K (W/kg) |
≤25 |
ASTM A257 |
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Core loss P0.3T/100K (W/kg) |
≤100 |
ASTM A257 |
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Permeability μ (1KHZ) |
≥70000 |
ASTM D5568 |
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Permeability μ (10KHZ) |
≥60000 |
ASTM D5568 |
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Permeability μ (100KHZ) |
≥10000 |
ASTM D5568 |
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Nano crystalline Magnetic sheet |
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Nanocrystalline Magnetic sheet |
Magnetic induction Bs/T |
1.25 |
ASTM A894 |
|
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μ’(@200 KHZ)Permeability |
500—1000(Adjustable) |
ASTM D5568 |
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μ’’(@200 KHZ)Permeability |
20—50(Adjustable) |
ASTM D5568 |
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Hc/(A/m) |
≤1.6 |
ASTM B887 |
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Resistivity δ (μΩ·cm) |
≥130 |
ASTM C611 |
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thickness/mm |
0.03-0.3(Adjustable) |
ASTM D374 |
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charge efficiency(5W) |
70%-90% |
—— |
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SQ New Materials provides end-to-end thermal management solutions for AI data centers, covering the entire value chain from thermal interface materials (TIMs) to complete liquid cooling systems. Our product portfolio includes carbon-based thermal conductive materials, thermal interface materials, heat pipes, vapor chambers (VCs), heat sinks, air-cooling modules, cold plate liquid cooling modules, and complete liquid cooling systems.







