Phase Change Thermal Pad


Phase Change Thermal Pads effectively fill air gaps and voids between mating surfaces, replacing trapped air between heat-generating electronic components and heat sinks. At room temperature, the material remains solid and easy to handle, making it ideal for use as a thermal interface pad. When the operating temperature reaches its phase-change temperature, the material softens and begins to flow, conforming to and filling microscopic irregularities on the contacting surfaces. This creates an interface with an ultra-thin bond line thickness and reduced thermal contact resistance, enabling more efficient heat transfer.Phase Change Thermal Pads are available in sheet, roll, and custom die-cut configurations.





Product Features
01
High Thermal Conductivity and Low Thermal Resistance


High Thermal Conductivity and Low Thermal Resistance
02
Excellent Tackiness


Excellent Tackiness
03
Optimized Phase-Change Temperature


Optimized Phase-Change Temperature
04
High Reliability


High Reliability
05
RoHS Compliant
RoHS Compliant
Product Specifications

Performance

Unit

SPCHS03

SPCHS04

SPCHS06

STC079A

Test method

Color

—

Grey

Grey

Grey

Grey

Visual inspection

Phase transition temperature

℃

52

52

52

45

ASTM D3418

Thickness

mm

0.1~0.5

0.1~0.5

0.1~0.5

0.1~0.5

ASTM D374

Density

g/cm3

2.5

2.93

3.10

2.75

ASTM D792

Flame retardant grade

—

V-0

V-0

V-0

V-0

UL94

Working temperature

℃

-40~125

-40~125

-40~125

-40~125

—

Thermal conductivity

W/m.K

3.0

4.0

6.0

8.0

ASTM D5470

Thermal resistance

℃.cm2/W @50PSi

0.104

0.097

0.077

0.045

ASTM D5470

Volume resistivity

Ω.cm

2*1012

2*1012

2*1012

2*1012

ASTMN D257


Understand the Plan
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop, full-chain thermal management solution, ranging from thermal interface materials to liquid cooling systems. This covers a comprehensive product line, including carbon-based thermal conductive materials, interface thermal conductive consumables, heat pipes/VC soaking plate cooling components, air cooling modules, cold plate liquid cooling modules, and complete liquid cooling supporting systems for machines.