Phase Change Thermal Pad


Phase Change Thermal Pads effectively fill air gaps and voids between mating surfaces, replacing trapped air between heat-generating electronic components and heat sinks. At room temperature, the material remains solid and easy to handle, making it ideal for use as a thermal interface pad. When the operating temperature reaches its phase-change temperature, the material softens and begins to flow, conforming to and filling microscopic irregularities on the contacting surfaces. This creates an interface with an ultra-thin bond line thickness and reduced thermal contact resistance, enabling more efficient heat transfer.Phase Change Thermal Pads are available in sheet, roll, and custom die-cut configurations.





Product Features
01
High Thermal Conductivity and Low Thermal Resistance


High Thermal Conductivity and Low Thermal Resistance
02
Excellent Tackiness


Excellent Tackiness
03
Optimized Phase-Change Temperature


Optimized Phase-Change Temperature
04
High Reliability


High Reliability
05
RoHS Compliant
RoHS Compliant
Product Specifications

Performance

Unit

SPCHS03

SPCHS04

SPCHS06

STC079A

Test method

Color

Grey

Grey

Grey

Grey

Visual inspection

Phase transition temperature

52

52

52

45

ASTM D3418

Thickness

mm

0.1~0.5

0.1~0.5

0.1~0.5

0.1~0.5

ASTM D374

Density

g/cm3

2.5

2.93

3.10

2.75

ASTM D792

Flame retardant grade

V-0

V-0

V-0

V-0

UL94

Working temperature

-40~125

-40~125

-40~125

-40~125

Thermal conductivity

W/m.K

3.0

4.0

6.0

8.0

ASTM D5470

Thermal resistance

℃.cm2/W @50PSi

0.104

0.097

0.077

0.045

ASTM D5470

Volume resistivity

Ω.cm

2*1012

2*1012

2*1012

2*1012

ASTMN D257


Understand the Plan
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop, full-chain thermal management solution, ranging from thermal interface materials to liquid cooling systems. This covers a comprehensive product line, including carbon-based thermal conductive materials, interface thermal conductive consumables, heat pipes/VC soaking plate cooling components, air cooling modules, cold plate liquid cooling modules, and complete liquid cooling supporting systems for machines.