Stock Code
301489
Air-Cooled Server Module Heat Sink
This air-cooled server radiator supports power above 650W with thermal resistance ≤0.035°C/W, a high-efficiency & reliable mid-to-high-end air cooling solution.It adapts to green data centers, industrial control and edge computing, operating stably in high-density and high-temperature environments with low energy consumption and simple maintenance.With optimized cooling structure, it breaks the heat dissipation bottleneck of ordinary high-power air cooling products.Cost-effective and capable of replacing mid-range server cooling schemes, it helps customers deploy high-end server business.
Bidirectional Temperature Control
01
High Power and Low Thermal Resistance
Supports up to 650 W of cooling power with thermal resistance as low as 0.035°C/W. Under an ambient temperature of 25°C, it can maintain the temperature of a 650 W chip at approximately 46°C during normal operation.
02
Lightweight and Compact
Lightweight and slim design meets the requirements of lightweight system architectures.
03
High Energy Efficiency
Utilizes airflow for heat dissipation, with no additional energy consumption by the heat sink itself.
Product Specifications
|
Product size |
349.7mm*312mm*43.56mm 1U |
|
Air volume |
120CFM |
|
Chip power |
650W |
|
Thermal resistance standard |
≤0.35℃/W |
|
Measured thermal resistance |
0.0329 ℃/W |
|
Chip model |
AMD SP7 |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop,
full-chain thermal management solution, ranging from thermal interface materials
to liquid cooling systems. This covers a comprehensive product line, including
carbon-based thermal conductive materials, interface thermal conductive
consumables, heat pipes/VC soaking plate cooling components, air cooling
modules, cold plate liquid cooling modules, and complete liquid cooling
supporting systems for machines.