Stock Code
301489
Ultra-thin Copper VC
Ultra-thin copper VC offer outstanding in-plane equivalent thermal conductivity. Compared with conventional solid copper or aluminum heat spreaders, their phase-change heat transfer mechanism delivers significantly higher thermal efficiency, enabling rapid dissipation of localized heat sources, improved cooling performance, and uniform heat spreading across the entire device.
As an advanced planar heat spreader, the copper VC provides superior temperature uniformity, faster thermal response, and longer service life than conventional metal heat spreaders. With its high thermal performance, excellent reliability, ease of fabrication, and broad design compatibility, it is widely used in medium- and small-power precision electronic devices.
Product Features
01
Efficient Phase
Change Heat Transfer – Utilizing a vacuum phase-change cycle, the VC achieves an equivalent thermal conductivity of 800–1200 W/m·K, enabling rapid thermal response and efficient dissipation of localized hot spots.
02
Excellent Manufacturability
The ductility and formability of copper allow ultra-thin structures, flanged edges, locking holes, localized grooves, and other complex geometries. Mature manufacturing processes ensure stable high-volume production.
03
High Cooling Capacity
Designed for 10–30 W thermal loads, with an overall thermal resistance of ≤0.15°C/Wunder standard operating conditions, ensuring stable cooling performance during sustained high-power operation.
04
Broad Assembly Compatibility
Supports pressure-sensitive adhesive bonding, screw mounting, insert molding, and other assembly methods, making it suitable for ultra-thin devices such as smartphones, tablets, and wearable electronics.
05
High Reliability
Manufactured using a proven vacuum brazing process with excellent hermetic sealing. The VC maintains stable thermal performance after thermal cycling and long-term aging tests, minimizing the risk of leakage or performance degradation.
Product Specifications
| Material | Service substance | Capillary structure | Moulding process | Edge banding | Working temperature(℃) | Thickness(mm) | Maximum size(mm) | Qmax(W) |
| Copper | Distilled water | Copper screen | Etching/Stamping | Brazing | 30~120 | 0.22~0.25 | 40*80 | 3~5 |
| 0.27~0.33 | 60*100 | 5 | ||||||
| 0.35~0.45 | 80*120 | 5~8 | ||||||
| 0.50~0.60 | 100*180 | 6~10 | ||||||
| 0.7~0.8 | 100*200 | 10~15 | ||||||
| 0. 8~1.0 | 100*200 | 12~18 | ||||||
| 1.10~1.30 | 150*250 | 15~25 | ||||||
| 1.50~1.70 | 200*250 | 25~45 |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop,
full-chain thermal management solution, ranging from thermal interface materials
to liquid cooling systems. This covers a comprehensive product line, including
carbon-based thermal conductive materials, interface thermal conductive
consumables, heat pipes/VC soaking plate cooling components, air cooling
modules, cold plate liquid cooling modules, and complete liquid cooling
supporting systems for machines.