For the thermal challenges of AI servers, high-speed optical modules, 5G communication base stations, and other equipment, SQ provides layered and fully integrated thermal management solutions across the entire system. Covering scenarios such as edge air cooling, cold-plate liquid cooling for complete systems, and ultra-thin uniform heat spreading for microdevices, we provide matched thermal interface materials, system-level protection, and customized thermal simulation services to address high-temperature, hotspot, and reliability challenges under high-density, high-power-consumption, and complex operating conditions, helping enable reliable thermal management for computing and communication equipment.