Stock Code
301489
Thermal Conductive Potting Compound
High thermal conductivity: Excellent heat spreading performance enables rapid and efficient heat dissipation in confined spaces.Excellent thermal stability: Oxidation in air begins only at temperatures above 250°C.Excellent flowability: Easily flows into and fills various cavities.Soft and flexible: Absorbs external impacts and reduces their effects on electronic components.
Bidirectional Temperature Control
01
High thermal conductivity: Excellent heat spreading performance enables rapid and efficient heat dissipation in confined spaces.
02
Excellent thermal stability: Oxidation in air begins only at temperatures above 250°C.
03
Excellent flowability: Easily flows into and fills various cavities.
04
Soft and flexible: Absorbs external impacts and reduces their effects on electronic components.
Product Specifications
|
Performance |
Organization |
STF08D |
STF10D |
STF15D |
STF20D |
STF30D |
STF40D |
Testing method |
|
Color |
— |
A: Pink/Grey B: White |
A: Pink/Grey B: White |
A: Pink/Grey B: White |
A: Pink/Grey B: White |
A: Pink/Grey B: White |
A: Pink/Grey B: White |
Visual inspection |
|
Density |
g/cc |
1.6±0.2 |
1.6±0.2 |
2.5±0.2 |
2.7±0.2 |
2.9±0.2 |
3.2±0.2 |
ASTM D792 |
|
Viscosity |
（mPa.S） |
A:1500-2500 B:1500-2500 |
A:2000-3500 B:2000-3500 |
A:3500-4500 B:3500-4500 |
A:4500-6500 B:4500-6500 |
A:13000-17000 B:13000-17000 |
A:20000-30000 B:20000-30000 |
ASTM D2196 |
|
Curing time (h @ 25℃) |
h@25℃ |
3-4 |
3-4 |
3-4 |
3-4 |
2-3 |
2-3 |
— |
|
Operable time (min @ 25℃) |
min@25℃ |
80-120 |
80-120 |
80-120 |
80-120 |
50-80 |
50-80 |
— |
|
Hardness |
shore A |
10-30 |
10-30 |
10-30 |
20-40 |
40-80 |
40-80 |
ASTM D2240 |
|
Thermal conductivity |
W/m*K |
0.8-1 |
1-1.2 |
1.5-1.7 |
1.8-2.2 |
3.0-3.2 |
4.0-4.2 |
ASTM D5470 |
|
Working temperature |
℃ |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
— |
|
Breakdown voltage |
KV/mm |
≥18 |
≥18 |
≥18 |
≥18 |
≥18 |
≥18 |
ASTM D149 |
|
Volume resistance |
Ω·cm |
≥1X1013 |
≥1X1013 |
≥1X1013 |
≥1X1014 |
≥1X1014 |
≥1X1014 |
ASTM D257 |
|
Flame retardant |
— |
V-2 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
UL94 |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop,
full-chain thermal management solution, ranging from thermal interface materials
to liquid cooling systems. This covers a comprehensive product line, including
carbon-based thermal conductive materials, interface thermal conductive
consumables, heat pipes/VC soaking plate cooling components, air cooling
modules, cold plate liquid cooling modules, and complete liquid cooling
supporting systems for machines.