Stock Code
301489
Thermal Silicone Pad
The STP Series Thermal Silicone Pads are high-performance thermal interface materials (TIMs) designed to fill air gaps between heat-generating components and heat sinks, eliminating air pockets and improving heat transfer efficiency. In addition to excellent thermal conductivity, they provide outstanding electrical insulation, inherent surface tack, flexibility, and compressibility, offering both thermal management and vibration damping. To meet diverse application requirements, customized options are available, including ultra-soft grades, fiberglass-reinforced constructions, and single-sided adhesive configurations.
Product Features
01
High thermal conductivity
02
Low stress
03
Single-sided or double-sided adhesive
04
Features fire resistance, high-temperature resistance, and insulation properties.
05
Elastic with a certain degree of adaptability and shaping capability, and does not overflow.
Product Specifications
|
ITEM |
UNIT |
STP15S |
STP20S |
STP30S |
STP40S |
STP50S |
STP60S |
STP70S |
STP80S |
STP100S |
STP140S |
Test Method |
|
Color |
/ |
Grey |
Grey |
Grey |
Grey |
Grey |
pink |
pink |
Pink |
Grayish-white |
Grayish-white |
Visual |
|
Density |
(g/cc) |
2.2 |
2.5 |
3.0 |
3.2 |
3.3 |
3.4 |
3.5 |
3.5 |
3.4 |
3.3 |
ASTM D792 |
|
Thickness |
(mm) |
0.5～5 |
0.5～5 |
0.5～5 |
0.5～5 |
0.5～5 |
0.5～5 |
0.5～5 |
0.5～5 |
0.5～5 |
0.5～5 |
ASTM D374 |
|
Hardness |
shore 00 |
40～60 |
40~60 |
40~60 |
40~60 |
40~60 |
50~70 |
50~70 |
50~70 |
50～70 |
50～70 |
ASTM D2240 |
|
Thermal Conductivity |
W/m*K |
1.5 |
2.0 |
3.0 |
4.0 |
5.0 |
6.0 |
7.0 |
8.0 |
10 |
14 |
ASTM D5470 |
|
Service Temperature |
℃ |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~180 |
-40~180 |
∕ |
|
Breakdown Voltage |
KV/mm |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
ASTM D149 |
|
Volume Resistivity |
ohm-cm |
1×1013 |
1×1013 |
1×1013 |
1×1013 |
1×1013 |
1×1013 |
1×1013 |
1×1013 |
1×1013 |
1×1013 |
ASTM D257 |
|
Dielectric Constant |
@1MHz |
7 |
7 |
7 |
8 |
8 |
8 |
8 |
9 |
9 |
9 |
ASTM D150 |
|
FRR |
/ |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
UL94 |
|
Note： Thickness deviation：T≤1mm±0.1mm@T＞1mm±10% Thickness tolerance：± 0.1mm（≤1mm）@ ±10%（>1mm）
|
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Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop,
full-chain thermal management solution, ranging from thermal interface materials
to liquid cooling systems. This covers a comprehensive product line, including
carbon-based thermal conductive materials, interface thermal conductive
consumables, heat pipes/VC soaking plate cooling components, air cooling
modules, cold plate liquid cooling modules, and complete liquid cooling
supporting systems for machines.