Thermal Grease

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Thermal Grease

The Thermal Potting Compound is a two-part addition-cure silicone material featuring low viscosity and excellent flowability. It provides outstanding electrical insulation and flame-retardant performance, making it ideal for encapsulating cavities in LED lighting, printed circuit boards (PCBs), mobile chargers, and other electronic assemblies. Its excellent self-leveling characteristics enable complete filling of complex cavities without the need for vacuum deaeration, making it especially suitable for high-volume production.

Product Features

Excellent thermal conductivity

Heat spreading performance enable rapid heat dissipation in confined spaces.

Stable at elevated temperatures

With oxidation beginning only above 250°C in air.

Supporting efficient and consistent manufacturing.

Suitable for application by screen printing or roller coating

Cost-Effective

Low material consumption, with only 0.5–3 g of thermal grease typically required per application, providing excellent cost performance.

Product Specifications

Performance	Unit	STR10C	STR10C-1	STR20C	STR30C	STR40C	STR46C	STR50C	STR60C	Test method
appearance	—	White paste	White paste	White paste	Gray paste	Gray paste	Gray paste	Gray paste	Gray paste	目视
Density	g/cc	2.2	2.3	2.5	3.0	3.2	3.3	2.6	2.6	ASTM D792
Viscosity	Pa.S	200	30	250	280	350	220	250	250	—
Thermal conductivity	W/m*K	1.0	1.0	2.0	3.0	4.0	4.6	5.0	6.0	ASTM D5470
Thermal resistance@30psi	℃*in2/W@BLT	0.048	0.012	0.015	0.015	0.011	0.015	0.009	0.008	ASTM D5470
Oil yield（%）	150℃/24h	＜0.2%	＜0.5%	＜0.2%	＜0.3%	＜0.3%	＜0.3%	＜0.5%	＜0.5%	GB/T 269
Fugitive constituent%	150℃/24h	＜0.5%	＜0.5%	＜0.5%	＜0.5%	＜0.5%	＜0.5%	＜0.5%	＜0.5%	GB/T 269
Working temperature	℃	-40~200	-40~200	-40~200	-40~200	-40~200	-40~200	-40~120	-40~120	—
Punch through voltage	KV/mm	≥6	≥6	≥6	≥6	≥6	≥6	≥6	≥6	ASTM D149
Volume resistivity	Ω·cm	1×1014	1×1013	1×1012	1×1012	1×1012	1×1012	1×1013	1×1013	ASTM D257
Dielectric constan@1MHz	—	7	7	7	7	8	8	8	8	ASTM D150

Understand the Plan

Full-chain solution from TIM material to liquid cooling system for AI data center

SiQuan New Materials provides a one-stop, full-chain thermal management solution, ranging from thermal interface materials to liquid cooling systems. This covers a comprehensive product line, including carbon-based thermal conductive materials, interface thermal conductive consumables, heat pipes/VC soaking plate cooling components, air cooling modules, cold plate liquid cooling modules, and complete liquid cooling supporting systems for machines.

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