Stock Code
301489
Liquid Cooling Module
A metal cold plate is attached to the surface of heat-generating components such as CPUs and GPUs. The coolant circulates through enclosed channels inside the cold plate to indirectly remove heat from the components. Since the coolant does not come into direct contact with electronic components, this is an indirect liquid cooling solution.
Product Features
01
Bonded to the surface of core heat-generating components
A metal cooling plate is bonded to the surface of core heat-generating components such as CPUs and GPUs;
02
Indirectly removing the heat;
a coolant circulates through the enclosed pipes within the cooling plate, indirectly removing the heat;
03
The coolant does not come into direct contact with the electronic components
Product Specifications
| HC | 200-400 | 50-400 | 17-100 | 0.85 | 1.7-2.3 |
| HC | 200-400 | 50-400 | 17-100 | 0.85 | 1.7-2.3 |
| HC | 200-400 | 50-400 | 17-100 | 0.85 | 1.7-2.3 |
| HC | 200-400 | 50-400 | 17-100 | 0.85 | 1.7-2.3 |
| HC | 200-400 | 50-400 | 17-100 | 0.85 | 1.7-2.3 |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop,
full-chain thermal management solution, ranging from thermal interface materials
to liquid cooling systems. This covers a comprehensive product line, including
carbon-based thermal conductive materials, interface thermal conductive
consumables, heat pipes/VC soaking plate cooling components, air cooling
modules, cold plate liquid cooling modules, and complete liquid cooling
supporting systems for machines.