Stock Code
301489
Two-Component Thermal Gel
The Two-Component Thermal Gel consists of Part A and Part B, mixed at a1:1 ratioand cured either at room temperature or under elevated temperature to form a soft, elastic material. Offering superior compression recovery and mechanical compliance, it is ideal for automotive electronics, including on-board chargers (OBCs) and battery management systems (BMS), as well as telecommunications and industrial electronic applications.
Product Features
01
Excellent Anti-Sag Performance
Maintains stable positioning without sagging or pump-out even after prolonged thermal cycling, with recommended filling thicknesses of 2–5 mm.
02
High Thermal Conductivity
Thermal conductivity of up to 8 W/m·K, compatible with automated dispensing equipment to improve production efficiency.
03
Flexible Processing Window
Adjustable working time to accommodate different manufacturing processes, with optional heat curing for rapid curing and reduced production cycle time.
Product Specifications
|
Performance |
STG10D |
STG20D |
STG40D |
ST50D |
STG60D |
STG80D |
|
Standard color |
A: Gray; B: White |
A: Yellow; B: White |
A: Blue; B: White |
A: Red; B: White |
A: Blue; B: White |
A: Deep gray; B: Gray |
|
mixing ratio |
1：1 |
1：1 |
1：1 |
1：1 |
1：1 |
1：1 |
|
Vscosity（Mpas） |
A：9W B：7W |
A：11W B：10W |
A：27W B：26W |
A：40W B：35W |
A：50W B：40W |
A：38W B：32W |
|
Density(g/cc) |
2.0±0.2 |
2.1±0.2 |
3.1±0.2 |
3.3±0.2 |
3.3±0.2 |
3.4±0.1 |
|
Hard after curing(shore 00) |
60±10 |
40±10 |
60±10 |
50±10 |
50±10 |
50±10 |
|
End-use temperature(℃) |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
|
Operate time(min/25℃） |
40 |
40 |
30 |
60 |
45 |
30 |
|
Curing time(min/25℃) |
80 |
80 |
70 |
120 |
120 |
80 |
|
Thermal conductivity(W/m*k) |
1.0 |
2.0 |
4.0 |
5.0 |
6.0 |
8.0 |
|
Dielectric constant @ 1MHz |
7.8 |
7.8 |
8.8 |
8.8 |
8.8 |
8.8 |
|
Punch through voltage(kV)(@1mm) |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
≥6 |
|
Mass resistivity （Ω·cm） |
＞1012 |
＞1012 |
＞1012 |
＞1012 |
＞1012 |
＞1012 |
|
Flame retardant rating |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop,
full-chain thermal management solution, ranging from thermal interface materials
to liquid cooling systems. This covers a comprehensive product line, including
carbon-based thermal conductive materials, interface thermal conductive
consumables, heat pipes/VC soaking plate cooling components, air cooling
modules, cold plate liquid cooling modules, and complete liquid cooling
supporting systems for machines.