Manifold


The manifold is an integrated piping unit designed to precisely distribute coolant flow and centrally collect return coolant within the liquid cooling system. Its key value lies in addressing the challenges of conventional decentralized piping systems, including uneven flow distribution, difficult flow control, and complex maintenance. It provides critical support for the transition from single-point liquid cooling applications to large-scale cluster deployment.




Product Features
01
The liquid cooling manifold is a pipe-integrated unit within a liquid cooling system

The liquid cooling manifold is a pipe-integrated unit within a liquid cooling system designed to "precisely distribute the coolant flow and uniformly collect the recirculated coolant"

The liquid cooling manifold is a pipe-integrated unit within a liquid cooling system
02
its core value lies in addressing the pain points associated with traditional decentralized piping system


Its core value lies in addressing the pain points associated with traditional decentralized piping systems—namely, "uneven flow distribution, difficulty in control, and complex operation and maintenance"  


its core value lies in addressing the pain points associated with traditional decentralized piping system
03
Single-point applications" to "cluster-based deployment.

serves as the fundamental enabler for the transition of liquid cooling technology from "single-point applications" to "cluster-based deployment."

Single-point applications
Product Specifications
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
Understand the Plan
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop, full-chain thermal management solution, ranging from thermal interface materials to liquid cooling systems. This covers a comprehensive product line, including carbon-based thermal conductive materials, interface thermal conductive consumables, heat pipes/VC soaking plate cooling components, air cooling modules, cold plate liquid cooling modules, and complete liquid cooling supporting systems for machines.