Stock Code
301489
Single-Component Silicone Adhesive
Single-component silicone adhesive features easy extrusion construction (4–40°C construction temperature). After curing, it withstands heat, UV, ozone & humid aging, stably working at -50°C~180°C. It firmly bonds plastics, glass and metals, applied for electronic structural bonding, sealing, insulation & damping, and home appliance moisture-proof sealing.Custom types optional: UL94 V‑0 flame retardant type, 0.5–2.0 W/m·K thermally conductive type, high-temperature flexible type, universal bonding type.
Bidirectional Temperature Control
01
Bidirectional Cooling & Heating Switch
Heating and cooling switch by reversing current without mechanical components.
02
Fast Temperature Response
Low thermal inertia ensures rapid temperature change for rigorous thermal cycling.
03
Large Temperature Difference & Precise Control
Max ΔT up to 73°C, closed-loop control delivers precision of ±0.01°C.
04
Reliable Solid-state Structure
No moving parts or coolant, shockproof, applicable to auto, medical and aerospace industries.
Product Specifications
|
Model number |
Product type |
Basic performance |
Characteristics |
|||
|
|
|
Drying time, min |
Status |
Shao Shi hardness, HA |
Tensile strength, MPa |
|
|
SSA511 |
De-alcoholized type |
10~30 |
Thixotropic paste |
35 |
>1.5 |
Good adhesion properties |
|
SYA-TB10 |
De-alcoholized type |
5-15 |
Thixotropic paste |
55 |
>1.5 |
UL94V-0 grade |
|
SSA505 |
De-alcoholized type |
5-20 |
Half-flowing |
30-40 |
>1.5 |
Permeability |
|
STA508 |
De-alcoholized type |
5~20 |
Thixotropic paste / self-leveling |
30 |
>1.5 |
Thermal conductivity: 0.5 - 2.0 W/m·K |
|
MS6036 |
Polyether modified adhesive |
10~20 |
Thixotropic paste |
50 |
>3.0 |
Wide range of adhesives |
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop,
full-chain thermal management solution, ranging from thermal interface materials
to liquid cooling systems. This covers a comprehensive product line, including
carbon-based thermal conductive materials, interface thermal conductive
consumables, heat pipes/VC soaking plate cooling components, air cooling
modules, cold plate liquid cooling modules, and complete liquid cooling
supporting systems for machines.