Designed for high-performance gaming laptops, thin-and-light creator laptops, and mobile workstations, our centrifugal cooling fans provide efficient and reliable air-cooling solutions for high-power mobile computing applications.

A heat pipe is a passive, highly efficient heat transfer device that utilizes phase change of an internal working fluid to transfer heat, achieving an equivalent thermal conductivity of 5,000–10,000 W/(m·K). Heat is transferred through a continuous cycle of evaporation, vapor transport, condensation, and capillary-driven liquid return. With heat transfer performance far exceeding that of solid metals such as copper and aluminum, heat pipes rapidly transfer localized heat over long distances. They are widely used in electronics, servers, energy storage systems, new energy equipment, and aerospace thermal management applications.

The standard vapor chamber (VC) is an industrial-grade phase-change heat transfer device featuring an oxygen-free copper enclosure with a sintered copper powder or copper mesh wick structure.

With an ultra-high in-plane thermal conductivity of ≥1500 W/m·K, Synthetic graphite sheet significantly improves heat dissipation efficiency and delivers excellent heat-spreading performance. As an ideal heat-spreading material, it offers higher in-plane thermal conductivity and lower density than conventional copper and aluminum foils. Synthetic graphite sheet combines outstanding thermal conductivity, high reliability, lightweight and ultra-thin construction, excellent processability, and environmental friendliness.

The STP Series Thermal Silicone Pads are high-performance thermal interface materials (TIMs) designed to fill air gaps between heat-generating components and heat sinks, eliminating air pockets and improving heat transfer efficiency. In addition to excellent thermal conductivity, they provide outstanding electrical insulation, inherent surface tack, flexibility, and compressibility, offering both thermal management and vibration damping. To meet diverse application requirements, customized options are available, including ultra-soft grades, fiberglass-reinforced constructions, and single-sided adhesive configurations.

The Single-Component Thermal Gel is a pre-formed, non-curing, non-flowing thermal interface material designed for filling micro gaps of up to2 mm. With thermal conductivity ranging from3 to 12 W/m·K, it supports automated dispensing, effectively compensates for assembly tolerances, and applies extremely low mechanical stress to electronic components—enabling near zero interface stress.

Amorphous alloy magnetic shielding sheets are manufactured from iron-based amorphous alloys, primarily composed of iron (Fe), nickel (Ni), silicon (Si), and other alloying elements. They feature high saturation magnetic flux density (1.4–1.7 T), high magnetic permeability, low coercivity, low excitation current, and low core loss, offering significantly better soft magnetic performance than conventional silicon steel. These magnetic shielding sheets effectively suppress magnetic interference in applications such as NFC antennas and active styluses, while improving magnetic field uniformity and signal stability.