Liquid Cooling Solutions for AI Data Centers

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End-to-End Solutions for AI Data Centers: From TIM Materials to Liquid Cooling Systems

SQ boasts robust engineering R&D capabilities, manufacturing capacity, and quality control systems covering liquid cooling cold plates and supporting components (CDUs, manifolds, quick-disconnect couplings, bellows), as well as graphite thermal conductive films and vapor chambers (VCs). We are capable of delivering comprehensive thermal management solutions for customers.

Product Solution Topology

Secondary side

CDU (Primary and secondary loop heat exchange, temperature/pressure/flow rate control)
Manifold (In-rack Coolant Distribution & Confluence)
UQD (Blind-mate quick replacement & leak-proof disconnection)
Corrugated Pipe（Flexible connection to absorb vibration and thermal expansion）
Cold Plate（Direct contact with chips for heat conduction and dissipation）
Thermal Interface Material（Fills microscopic gaps at the interface to reduce contact thermal resistance）

Advantages of the Solution

Excellent cooling performance, significantly reducing the PUE of data centers
High compatibility, with no need to change the existing architecture of the server and the computer room
High adaptability, suitable for both the deployment of brand-new data center rooms and the renovation of existing ones
High reliability, with a design lifespan of 10 years