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Synthetic graphite exhibits ultra-high thermal conductivity of ≥1500 W/m·K within its plane. In practical applications, it can enhance heat dissipation efficiency and achieve a "uniform heat" effect. Synthetic graphite film is an ideal thermal diffusion material, boasting a higher lateral thermal conductivity and lower density compared to traditional copper and aluminum foil materials. Synthetic graphite film is characterized by its high thermal conductivity, high reliability, lightness, thinness, ease of processing, and environmental friendliness.
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Product Features
01
Good thermal stability

Lightweight and thin, with a density lower than traditional thermal conductive materials: 1.7-2.3 g/cm3, equivalent to 75% of aluminum and 25% of copper. Thickness: 15-100um

Good thermal stability
02
High thermal conductivity

Lightweight and thin, with a density lower than traditional thermal conductive materials: 1.7-2.3 g/cm3, equivalent to 75% of aluminum and 25% of copper. Thickness: 15-100um

High thermal conductivity
03
Lower density than traditional thermal conductive materials

Lightweight and thin, with a density lower than traditional thermal conductive materials: 1.7-2.3 g/cm3, equivalent to 75% of aluminum and 25% of copper. Thickness: 15-100um

Lower density than traditional thermal conductive materials
04
Good flexibility

Lightweight and thin, with a density lower than traditional thermal conductive materials: 1.7-2.3 g/cm3, equivalent to 75% of aluminum and 25% of copper. Thickness: 15-100um

Good flexibility
05
Provide more design possibilities

Lightweight and thin, with a density lower than traditional thermal conductive materials: 1.7-2.3 g/cm3, equivalent to 75% of aluminum and 25% of copper. Thickness: 15-100um

Provide more design possibilities
Product Specifications
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
HC 200-400 50-400 17-100 0.85 1.7-2.3
Understand the Plan
Understand the Plan
Full-chain solution from TIM material to liquid cooling system for AI data center
SiQuan New Materials provides a one-stop, full-chain thermal management solution, ranging from thermal interface materials to liquid cooling systems. This covers a comprehensive product line, including carbon-based thermal conductive materials, interface thermal conductive consumables, heat pipes/VC soaking plate cooling components, air cooling modules, cold plate liquid cooling modules, and complete liquid cooling supporting systems for machines.
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