The thermal phase change material, applied .the high power device and the heat sink can improve device reliability for its extremely low thermal resistance. The phase change material can well fill the gap .the interfaces, forming a better contact .the two interfaces, so it can improve the overall heat dissipation efficiency. The phase change material PCM40 is solid at room temperature, easy for cutting and mounting the phase change material of the sheet on the surface of the heat sink.chip. When the phase change temperature is reached, the material becomes soft to flow, and the lower viscosity enables it to better fill the tiny gap .the interfaces, forming more excellent contact and low thermal resistance.

Product structure:

Protective film, phase change material, release paper

Product features:

Very low thermal resistance and efficient heat storage

Excellent thermal stability and high reliability

No pollution since no silicone oil precipitates

Can be mounted directly on the surface of the heat sink for its natural vicosity

Phase change temperature can be customized

ROHS compliant

Applications:

Mobile terminals such as mobile phones, tablets, and laptops

TV, game console

Semiconductor LED lighting

.the chip and the thermal module

Communication equipment

High-performance CPU and GPU heat dissipation